APL-TD-4415

  • China
5W-22W options in 40-45mm slim profiles. "Small cutout, large faceplate" design fits Φ75-200mm openings. SMD2835 source (70-80lm/W efficacy), AC160-265V input. PP housing with steel heatsink. 70-80 CRI, non-dimmable (PF≥0.5). EU/ASEAN certified. Ideal for warehouse/industrial retrofits.

I. Revolutionary Form Factor Architecture

"Small Cutout, Large Faceplate" Design Philosophy

  • Core Innovation: 80-130mm faceplates conceal 75-120mm openings, covering ceiling irregularities (±3mm tolerance)

  • Engineering Benefit: Maximizes light emission area while minimizing structural intrusion (H40 slim profile)

  • Retrofit Advantage: Single downlight fits multi-generational cutouts in EU/Asian buildings


II. Power Scalability Platform

WattageFaceplate ØCutout ØLumen OutputApplication Profile
5W100mmΦ75mm350-400lmNiche accent lighting
7W110mmΦ90mm500-560lmHotel corridor zones
12W120mmΦ90mm840-900lmRetail task lighting
18W130mmΦ120mm1,260-1,350lmIndustrial workbenches
22W150mmΦ150mm1,540-1,650lmWarehouse aisle lighting
(Custom)180-220mmΦ200mm2,200lm+High-bay pre-rollout

Note: All variants maintain constant 40-45mm depth - industry's thinnest multi-watt solution


III. DOB Technology Integration

Driver-on-Board AC Direct System

  • Circuit Topology: Passive PFC buck converter (No IC - discrete components only)

  • Voltage Optimization: Narrow-range AC160-265V targeting stable-grid regions (SE Asia/Latin America)

  • Thermal Management:

    • 22W model: Cold-rolled steel heatsink (1.2mm) with 48 fins

    • ≤18W: Die-cast zinc alloy base


IV. Material Science Breakdown

ComponentMaterialCertificationFunctional Purpose
Housing TrimPolypropylene (PP)UL94 HB flame retardantElectrical isolation + 120°C stability
Heat Sink AssemblyCRC steel (0.8-1.2mm)ISO 9227 salt spray 96hr5.8W/mK thermal conductivity
Optical ChamberAluminumized reflectorEN ISO 11664 photometric84% reflectivity (vs. 70% industry avg)
Light SourceSMD2835 (120Lm/W bin)LM-80 Q90 reportingCost-optimized efficacy solution

V. Photometric & Electrical Profile

Standard Testing Conditions (Ta=25°C)

ParameterSpecificationTest Standard
Luminous Efficacy70-80 lm/WLM-79-08 Annex B
CRI (Ra)70-80 (Typ. 75)CIE 13.3-1995
Power Factor≥0.5 (±0.02 full range)EN 61000-3-2 Class C
THD<25% @230VIEC 62301
Inrush Current20A (max, 10μs pulse)EN 60947-1

Thermal Performance

  • Junction Temp: ≤105°C @18W (Ta=40°C) - validated via IR thermography

  • L70 Lifetime: 25,000hrs (TM-21 extrapolation for 70-80°C Tc)


VI. Regional Compliance Matrix

MarketElectricalEMCMaterial
EU/UKEN 60598-1 + EN 61347-1EN IEC 55015/61547RoHS 2015/863
ASEANCNS 14115 (Taiwan)CISPR 15 Ed.7.0MS IEC 60065
Middle EastESMA UAE.S 5019-1GSO 1613SASO 2870
ExclusionsNot UL/cUL certifiedNon-dimmableIP20 (dry indoor)

VII. Installation Engineering

Critical Clearance Protocol

  1. Thermal Buffer: Maintain ≥20mm air gap between ceiling & housing (clause 12.5 EN 60598)

  2. Wiring Specification: 0.75-1.5mm² solid/core cables only (terminal capacity: 2×2.5mm²)

  3. Mounting Sequence:

    • Insert springs vertically → rotate 90° until click

    • 35kg max. pull-out force certification


VIII. Ordering & Logistics

WattageCarton QtyGW/CartonPallet StackProduction Lead
≤12W24 pcs5.4kg8 layersSTD: 15 days
18-22W12 pcs6.1kg5 layersCustom: 30 days

Packaging Detail:

  • Anti-static foam slot packaging (ESD 20kV protection)

  • Master carton labeling: Voltage bins (V1:160-210V / V2:210-265V)


IX. Application-Specific Guidelines

  • Low CRI Warning: Not recommended for art galleries/medical facilities (use ≥90CRI variants)

  • High Bay Pre-wiring: Dedicated suspension kits required for >5m mounting height

  • Voltage Caution: Avoid installation in <150V grids (Japan/110V regions excluded)


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