Why Traditional Driver Solutions Outperform DOB Solutions in Stability

🔥 1. Thermal Management Design (Core Difference)

Traditional Driver Solution
The driver circuitry is physically isolated from the LED light source, eliminating shared thermal pathways. Temperature-sensitive components (e.g., electrolytic capacitors, MOSFETs) operate below 75°C, aligning with their design limits (e.g., electrolytic capacitor lifespan doubles for every 10°C drop, per the Arrhenius equation).

DOB (Driver-on-Board) Solution
Driver circuits are integrated directly onto the aluminum substrate, sharing thermal paths with LEDs. Typical operating temperatures exceed >90°C, causing:

• Exponential degradation of electrolytic capacitors (lifespan halves per 10°C rise);

• Magnetic components (inductors/transformers) suffer reduced saturation current, dropping efficiency by 5–10%;

• PCB copper impedance shifts increase current fluctuation.

Case Study: Void-filled solder layers or poor die-attach quality in DOB further escalate thermal resistance, accelerating device aging.

⚡ 2. EMC Performance

Traditional Driver Solution
Metal enclosures provide EMI shielding and accommodate multi-stage filtering (X/Y capacitors, common-mode chokes), effortlessly passing Class B EMC tests with robust suppression of radiated (RE) and conducted emissions (CE).

DOB Solution
High-frequency switching circuits (e.g., Buck topology) are exposed on the PCB:

• Prone to harmonic interference (150kHz–30MHz);

• 60% risk of RE violations due to absent shielding;

• Requires added filters/magnetic rings, increasing complexity.

Data: DOB exhibits 15–20dB higher EMI noise at 30–100MHz in lab tests.

⚡ 3. Electrical Stress Tolerance

DOB’s compact PCB limits space for large MOV varistors, weakening surge protection. Traditional drivers integrate multi-stage circuits (e.g., gas discharge tubes + TVS diodes).

Mains-Frequency Flicker
DOB relies on valley-fill capacitors to suppress 100Hz flicker, but capacitor failure exacerbates flicker. Traditional drivers eliminate flicker via high-frequency switching (>20kHz).

🛠️ 4. System Reliability Comparison

Key Factors:

• DOB electrolytic capacitors last 10k–20k hours at high temps vs. >50k hours in traditional drivers;

• DOB integration forces full fixture replacement (near 100% repair cost), while modular drivers cost <30% to replace.

🔄 5. DOB Improvements & Limitations
Despite stability enhancements, inherent flaws persist:

• Electrolytic-free designs: Use MLCC capacitors but increase cost by 50–80% with limited capacitance;

• Thermal interface upgrades: High-conductivity pads (>6W/m·K) partially mitigate shared heat but fail to resolve core issues;

• Smart IC protection: Current throttling under overheating restricts power to ≤15W, narrowing applications.

💎 Conclusion & Selection Guidelines

Summary: Traditional drivers excel in thermal management, electrical robustness, and maintainability through physical isolation, independent EMC shielding, and modular design. DOB, despite cost/size benefits, remains constrained by component longevity and stability at high temperatures.